Some thermal interfaces (the all-important goo between your CPU and heatsink) are easier to apply than others, and liquid metal typically requires careful application by hand. For that reason, it’s not often found in mass assembled laptops, but Asus came up with a way to automate the application of liquid metal, and will be including it in upcoming ROG gaming laptops.

Regardless of the type, thermal compound is designed to fill in the microscopic nooks and crannies in the surfaces of the heatsink and your processor’s integrated heatspreader. It’s also conductive, and makes more efficient work of transferring heat from the CPU to the cooler.

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